Leading the way for over 40 years
Mer-Mar Electronics is a one-stop solution for varied BGA Assembly service like BGA PCB assembly, BGA component removal, BGA replacement, reflow soldering, site preparation, solder paste application, BGA rework & reballing services, circuit pattern design changes at BGA sites, repair of lifted/missing BGA pads, repair of solder mask at the BGA sites. We have extensive experience and knowledge in mounting high-performance devices using Ball Grid Array.
We provide specialized ball grid array (BGA) board assembly services for testing and inspection purposes as a part of the BGA assembly process as well. We are also capable of handling all types of BGAs and µBGA to large size BGAs. We analyze the BGA sheet, BGA size, ball material composition, and optimize the thermal profile of BGA to enhance the quality and reliability of the assembly process. Get all the solutions for your BGA rework and repair requirements.
We are an ISO certified company with advanced manufacturing and inspection equipment for producing high-quality BGA assembly boards. We have IPC trained employees and adopt triple process inspection for meeting the highest quality standards for Ball Grid Array Assembly requirements. Be assured of all the Ball Grid Array Assemblies manufactured with specialized support, reliability testing, and authorized workmanship. You can get top quality ball grid array printed circuit board assembly from our qualified team of experts.
Build High-performing Electronics with
Best-in-class BGA Assembly Service
High-quality – Mer-Mar Electronics has immense expertise in Ball Grid Array (BGA) assemblies. We have a proven track record in producing high-quality circuit boards with soldering excellence and high-precision component placement.
Superior Electrical Performance – We capitalize on the BGA packages’ shorter leads package for ensuring excellent electrical performance on the high-speed circuit boards. Any unwanted signal distortions are also curbed in the high-speed electronics applications.
BGA Prototyping Services – We have sophisticated equipment and in-house capabilities to assemble BGA prototyping boards. With recent technologies and staggering 4 decades of experience, we carry out various BGA prototyping board services.
Improved Operational Efficiency – We offer BGA rework and repair services and deliver light-weight and compact electronics. Even the badly damaged BGAs can be easily repaired and help regain their operational efficiency and performance.
BGA PCB Assembly
BGA Assembly Services
Our experienced engineering team is proficient in BGA (Ball Grid Array) assembly process along with X-ray inspections. We are confident of building a high-quality and good yield rate BGA assembly boards by following the right procedures. We start the process by creating a BGA prototype and help the customer to reduce unnecessary costs and turnaround times. Whether you need metal-core BGA or plastic or ceramic ones, we can get that to you in the shortest time.
As we use the solder reflow process for soldering BGA onto the circuit board, we follow all the precautions to ensure good soldering techniques. We make sure to apply sufficient heat to ensure that all the balls are melted sufficiently and a strong bond is established. We also try to maintain the optimum temperature and prevent the solder balls from short-circuiting. If you are worried about the quality, we make sure to pay attention to the composition of the solder alloy, and the right temperatures are applied to keep the solder in the desired semi-liquid state.
At Mer-Mar Electronics, we have the capabilities to take on BGA rework and reballing for different types of land grid array packages like plastic BGA, chip BGA, ceramic column grid array. We help you restore your BGAs to their original performance and quality with solution-driven rework and reballing services. We correct any defects in the device, fix the solder joints, or oversights during the upgrade process during the BGA rework process. With comprehensive BGA reballing services, we maintain the efficacy of the SMT boards.
BGA Assembly Families
Mer-Mar Electronics is one of the leading companies in BGA assembly and has experience with all the three BGA assembly family types like PBGA (plastic BGA), TBGA (tape BGA), and CBGA (ceramic BGA). Whether you need lead or lead-free solder balls, you are at the right place! We use a variety of subtypes based on the substrate and packaging materials for creating custom designs and connecting the packages to the circuit board.
Our fine engineering team is constantly working on fine pitch BGAs and putting extra effort to reduce the board costs. We assemble fine pitch BGAs for many devices like mobile phones, notebook mainboards, etc. We identify the root causes of the BGA defects like solder joint cracks. We perform a variety of tests to create flawless BGA fine pitches that can steadily move into next-generation products.
With proper quality controls and inspection methods, we ensure to provide the BGA Assemblies with zero defects before it is shipped. We deploy a 3D X-ray inspection process for eliminating soldering problems like solder bridging and insufficient ball melting. We also add additional inspection layers to get the BGA profile correct. We assure you of excellent quality and reliable BGA assembly boards.
BGA Assembly Capabilities
|Leadless BGAs||Micro Ball Grid Array (µBGA)
Thin Chip Array Ball Grid Array (CTBGA)
Chip Array Ball Grid Array (CABGA)
Very Thin Chip Array Ball Grid Array (CVBGA)
Very Fine Pitch Ball Grid Array (VFBGA)
Land Grid Array (LGA)
Chip scale Package (CSP)
Wafer level chip scale packaging (WLCSP)
|BGA Assembly Size||2mm x 3mm/1x1mm to 45mm/50x50mm|
|Passive Footprints||0201, Press fit, 01005, POP, 0603, and 0402.|
|Pitch Size||Minimum pitch sizes 0.4mm and placement accuracy +/- 0.03 mm|
|No. of layers||Up to 36|
|Equipment||automatic placement machines, automated solder dispensing machines, reflow oven, X-ray and AOI inspection systems|
|BGA Assembly Service Types||Plastic BGA (PBGA)
Ceramic BGA (CBGA)
Micro Fine Line BGA (MBGA)
Lead BGA and leadless BGA
|Testing and Inspection||X-ray inspection for several chip packages. We also provide functional testing and Automated Optical Inspection (AOI).|
BGA (Ball Grid Array) Assembly Testing Capabilities
Mer-Mar Electronics is doing its best to make sure you achieve the level of optimization and reliability required. We use Surface Mount Technology (SMT) inspection or BGA inspection to analyze the chip-PCB connections. We constantly monitor various aspects of the assembly using a variety of inspection techniques like
- Optical Inspection
- Mechanical Inspection
- X-ray Inspection
Optical Inspection – We closely view the ball grid array connections with the surface of the PCB using the proper equipment like an endoscope. We have deployed efficient personnel and employed the equipment for optical inspection in the market for assessing the quality of the assembly process.
Mechanical Testing – This is done through shock tests in which the full assembly is subjected to shock. The mechanical properties of the solder joints are evaluated by looking at and measuring the strain.
X-ray Inspection – We have adopted this most advanced method of BGA testing to get a clear picture of the entire process. Under the X-ray test, we see clearly the ball grid image where we visually analyze the connections that usually cannot be optically inspected. We constantly inspect the joints and monitor the quality. We make sure there are no alignment issues and the ball grid array connections are symmetrical.
BGA PCB Assembly Techniques
Mer-Mar Electronics is capable of ensuring SMT quality and decrease assembly defects. With modern manufacturing methods, we have been providing the SMT assembly process of BGA components for all volume production.
Surface Mount technology –Before we go for the assembly process, we make sure all the components go through the preheat treatment to make sure that they are sensitive to humidity and high temperatures. Before proceeding to the mounting of components, eliminate the moisture. We are skilled in solder paste printing, and solder paste is easily printed on the BGA components. Our engineers are skilled in both horizontal and vertical printing.
BGA SMT Soldering –We mount the components with high precision and even under heavy vibrations, they remain unfazed. We have a specialized SMT assembly line containing chip mounter on & offline AOI equipment, reflow soldering oven, solder paste printer, BGA rework station, etc. We provide a solid foundation for the BGA assembly boards and live up to the customer expectations.
Applications of BGA Assembly
With BGA assembly providing numerous advantages for high-density PCB products and allows excellent electrical performance and heat conduction.
BGA assembling techniques are quite commonly used in various applications that include
- Military airborne
- Consumer electronics
- LED Industry
- Wireless & Telecommunications
- Flat electronic systems
- ICs in Computers, TVs, Phones
- Consumer electronics
BGA Assembly FAQs
Are you looking for BGA assembly for your next project? Send us inquiry to Get a Quick BGA PCB Assembly Quote based on your custom requirements.
If you have any queries regarding to our BGA PCB assembly service or need an urgent assistance, then please don’t hesitate to contact our team of skilled personnel’s. Send us an email with your queries at firstname.lastname@example.org or call us at (760) 244-6149. We are looking forward to hearing from you.